PI resin

PI resin

Solvent-based Polyimide Resin: SI-3041/3046

Dile®Polyimide is one of the organic polymer materials with excellent comprehensive performance. It has a high-temperature resistance of over 400°C and a long-term service temperature range of -200 to 300°C, along with high insulating properties. It is widely used in films, coatings, advanced composite materials, fibers, foam plastics, adhesives, photoresists, insulating materials, liquid crystal display orientation agents, electro-optical materials, humidity-sensitive materials, aviation, aerospace, microelectronics, nanotechnology, separation membranes, and laser lighting fields.

Product

Code

Solids Content

%

Viscosity

cps

Remarks


SI-3041

15±1

1000-5000

Solvent-based PI

SI-3046 

15±1 

1000-5000 

Solvent-based PI